TY  - BOOK
AU  - Tummala,Rao R.
TI  - Fundamentals of device and systems packaging: technologies and applications 
SN  - 1259861554
U1  - 621.381046 23
PY  - 2019///
CY  - New York
PB  - McGraw-Hill
KW  - Microelectronic packaging
N1  - Formerly CIP; Includes bibliographical references and index
UR  - https://drive.google.com/drive/folders/14RXsN4XvB2QNL8wE8B7SS5gelUq8GLC3?usp=sharing
ER  -