| 000 | 01275pam a2200337 i 4500 | ||
|---|---|---|---|
| 001 | 45353 | ||
| 003 | 0000000000 | ||
| 005 | 20240411193149.0 | ||
| 008 | 190711s2019 nyu s 000 0 eng d | ||
| 015 |
_aGBB9C4599 _2bnb |
||
| 016 | 7 |
_a019469712 _2Uk |
|
| 020 |
_a1259861554 _qhardcover |
||
| 020 |
_a9781259861550 _c£134.99 _qhardback |
||
| 035 | _a(Uk)019469712 | ||
| 040 |
_aStDuBDS _beng _cStDuBDS _dUk _erda |
||
| 042 | _aukblcatcopy | ||
| 082 | 0 | 4 |
_a621.381046 _223 |
| 245 | 0 | 0 |
_aFundamentals of device and systems packaging : _btechnologies and applications / _c[edited by] Rao R. Tummala |
| 250 | _a2nd edition. | ||
| 264 | 1 |
_aNew York : _bMcGraw-Hill, _c2019 |
|
| 300 |
_axx, 828 pages : _billustrations, 1 map ; _c25 cm |
||
| 336 |
_atext _2rdacontent |
||
| 337 |
_acomputer _2rdamedia |
||
| 338 |
_aonline resource _2rdacarrier |
||
| 500 |
_aFormerly CIP. _5Uk |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 | _aMicroelectronic packaging. | |
| 700 | 1 |
_aTummala, Rao R., _d1942- _eeditor. |
|
| 856 | _uhttps://drive.google.com/drive/folders/14RXsN4XvB2QNL8wE8B7SS5gelUq8GLC3?usp=sharing | ||
| 999 |
_c14339 _d14339 |
||